Retainer Ring

Retainer Ring

A retaining ring is a critical component used in CMP (Chemical Mechanical Planarization) tools. It is installed around the outer perimeter of the wafer carrier and plays an essential role during the polishing process.

Main Functions
    • Secures the wafer in place to prevent shifting during polishing
    • Controls edge pressure distribution to avoid over-polishing or under-polishing at the wafer edge
    • Helps maintain uniform contact with the polishing pad to improve planarization performance
      • Product Models
      • Retaining Ring for Metal
      • Retaining Ring (for T1- Oxide)
      • 8″SUS PPS AEP RING for Titan2 Profiler Head
      Specifications & Features
      • Material options: SUS, PPS, PEEK, etc.
      • Size options: 8-inch, 12-inch, and more (customizable)
      • High precision to ensure stable wafer positioning and uniform polishing
      • Wear-resistant design to extend service life and improve process stability
      • Custom design available for customer tools (e.g., AMAT, Ebara, TEL)
      Applications
      • Widely used in CMP processes for semiconductor wafer manufacturing
      • Compatible with various polishing heads (e.g., Titan2, Titan3, R-head, G2 head, etc.)
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